Microelectronics packaging technology roadmaps, assembly reliability, and prognostics
نویسندگان
چکیده
منابع مشابه
High Reliability Plastic Packaging for Microelectronics
This Laboratory Directed Research & Development (LDRD) project conducted in fiscal years 1996 and 1997 under case 3526.030 was devoted to the development of test structures and associated measurement methodology for assessing the reliability of plastic encapsulated microelectronic devices. The end goal was the conceptual specification of one or more Assembly Test Chips (ATCs) which could be use...
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An advanced substrate level patterning technique is presented to realize 3D interconnection circuitry on electronic modules. The technique is based on diffraction of light by phase gratings. The phase gratings are incorporated into the photomask at discrete locations. By illuminating the photomask at normal incidence, the phase grating causes locally inclined UV exposure, which is used to expos...
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ژورنال
عنوان ژورنال: Facta universitatis - series: Electronics and Energetics
سال: 2016
ISSN: 0353-3670,2217-5997
DOI: 10.2298/fuee1604543g